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The dual damascene process has been widely adopted for the metallization of advanced logic devices, but due to its high cost per layer and the requirement to implement chemical mechanical polishing (CMP), dual damascene is not viewed as a viable alternative for those devices cited above who now need to embrace the use of copper. A new methodology is required to enable the cost-effective deposition of thick, tightly-spaced copper structures.

Electrochemical Pattern Replication, ECPRTM, provides precisely these advantages: deposition of copper structures in excess of 3 µm thick with 5 µm or less spacing between features, no requirement for CMP or photolithography equipment or related materials plus the added advantage of eliminating the use of solvents

With ECPRTM you can simultaneously reduce your cost/layer and improve the performance of the patterned metal layer.



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